Sunburst Electronics Manufacturing Capabilities

always improving capabilites

PCB Board Assembly

  • Surface mount (SMT),

  • Through-hole (PTH) automatic insertion

  • Flexible circuits,

  • Mixed technology

  • Rigid, Flex, FR-4, metal and hybrid

  • Single or double-sided, multiple layers

  • Single board or panelization

  • RoHS-compliant and tin-lead options

  • BGA and micro BGA, fine pitch to 4 mil

  • Components to 1005

  • Prototype through full production

  • Conformal coatings, potting

  • Wave Solder, selective solder, hand solder

  • DI water and no-clean

  • Full turnkey assemblies

  • Labor only, customer consigned components

Box Builds

  • Enclosure assembly

  • Chassis assembly

  • Electro-mechanical assembly

  • Backplane plug-ins

  • Power supply

  • Cable and wire harness

  • System testing

  • Environmental stress screening

    • Burn-in

    • Vibration

    • Software loading

  • Very high tonnage handling capability

  • Mechanical revisions/configurations

  • AC/DC/battery backup, multiple voltage, 1 to 26 gauge wiring schemes

  • High voltage testing and handling

  • Configure to order

    • True models and options flexibility

    • Robust demand planning

    • “Vanilla-level” starting points

    • Module/feature planning

Cable Assemblies

  • Ribbon

    1. Flat

    2. Shielded

    3. Jacketed

    4. Wire size: 1 to 30 gauge

    5. Cut, stripped, terminated, labeled, and kitted

  • Uniform connections

  • No mix-up of individual wires

  • Time savings of up to 50% during installation

  • Lower scrap rates

  • Lower inventory costs

  • Semi-finished goods inventory

Engineering Services

  • Lifecycle management

  • Circuit board schematic and layout engineering

  • Input of board design optimization

  • Box-build for turnkey solutions

  • Hardware, software and firmware engineering

  • Development of functional test and fixtures

  • New product introduction

  • LabView software test systems

  • Functional testing

  • Vibration testing

  • Environmental stress screening (-30 deg. C to +70 deg. C)

  • Chip programming

  • Customized burn-in cycling

  • In-circuit testing utilizing flying probes

  • Production-test planning

  • Functional test development

    • Hardware

    • Software

  • Flying probe programming