Sunburst Electronics Manufacturing Capabilities

always improving capabilites

PCB Board Assembly

  • Surface mount (SMT),
  • Through-hole (PTH) automatic insertion
  • Flexible circuits,
  • Mixed technology
  • Rigid, Flex, FR-4, metal and hybrid
  • Single or double-sided, multiple layers
  • Single board or panelization
  • RoHS-compliant and tin-lead options
  • BGA and micro BGA, fine pitch to 4 mil
  • Components to 1005
  • Prototype through full production
  • Conformal coatings, potting
  • Wave Solder, selective solder, hand solder
  • DI water and no-clean
  • Full turnkey assemblies
  • Labor only, customer consigned components

Box Builds

  • Enclosure assembly
  • Chassis assembly
  • Electro-mechanical assembly
  • Backplane plug-ins
  • Power supply
  • Cable and wire harness
  • System testing
  • Environmental stress screening
    • Burn-in
    • Vibration
    • Software loading
  • Very high tonnage handling capability
  • Mechanical revisions/configurations
  • AC/DC/battery backup, multiple voltage, 1 to 26 gauge wiring schemes
  • High voltage testing and handling
  • Configure to order
    • True models and options flexibility
    • Robust demand planning
    • “Vanilla-level” starting points
    • Module/feature planning

Cable Assemblies

    • Ribbon
    • Flat
    • Shielded
    • Jacketed
    • Wire size: 1 to 30 gauge
    • Cut, stripped, terminated, labeled, and kitted
  • Uniform connections
  • No mix-up of individual wires
  • Time savings of up to 50% during installation
  • Lower scrap rates
  • Lower inventory costs
  • Semi-finished goods inventory

Engineering Services

  • Design for manufacture (DFM)
  • Design for test (DFT)
  • Lifecycle management
  • Circuit board schematic and layout engineering
  • Input of board design optimization
  • Box-build for turnkey solutions
  • Hardware, software and firmware engineering
  • Development of functional test and fixtures
  • New product introduction
  • LabView software test systems
  • Functional testing
  • Vibration testing
  • Environmental stress screening (-30 deg. C to +70 deg. C)
  • Chip programming
  • Customized burn-in cycling
  • In-circuit testing utilizing flying probes
  • Production-test planning
  • Functional test development
    • Hardware
    • Software
  • Flying probe programming